Hongshang's heatshrink without adhesive, identified as 2111642118, features a 2:1 shrinkage ratio, suitable for covering 6.40 mm to 3.20 mm diameters. This white heatshrink is designed for electrical insulation and bundling applications. It is commonly used in electronics for providing protection and enhancing the durability of wiring and components.
Type |
Heatshrink w/o adhesive |
Factory colour |
White |
Heatshrink features |
Thin-walled |
Manufacturer part # |
2111642118 |
Material |
Polyolefin |
Max. temperature |
+125°C |
Min. temperature |
-55°C |
Misc Attribute |
H-2(Z) |
Nominal diameter (post-shrinkage) |
3.20mm |
Nominal inside diameter (pre-shrinkage) |
6.40mm |
RoHS-compliant |
Yes |
Shrink temperature (max.) |
+100°C |
Shrink temperature (min.) |
+70°C |
Shrinkage |
2:1 |
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