TE Connectivity's 6-5330808-5 is a miniature unshrouded IC socket.
It features a reliable dual-wipe contact system with gold plating for enhanced conductivity.
The socket is ideal for use in electronics assemblies requiring high-density connections.
Its compact design is suited for use in limited space applications.
| Row Pitch |
Not Applicable |
| Circuit Application |
Signal |
| Connector & Contact Terminates To |
Printed Circuit Board |
| Connector System |
Cable-to-Board |
| Contact Base Material |
Beryllium Copper |
| Contact Current Rating (Max) |
3 |
| Contact Mating Area Plating Material |
Gold (Au) |
| Contact Mating Area Plating Material Thickness |
30 |
| Operating Temperature Range |
-85 – 257 |
| Packaging Method |
Loose Piece |
| Packaging Quantity |
2000 |
| PCB Thickness (Recommended) |
.031 – .125 |
| Sealable |
No |
| Termination Method to PCB |
Through Hole - Press-Fit |
| Termination Method to Wire & Cable |
Solder |
| Type |
Pin Sockets |
| Wire Size |
28 – 25 |
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