A quick drying, mildly activated (RMA type) no-clean flux for use when removing and replacing surface mount components. Particularly recommended for precision products e.g. telecommunications or professional computers where a high degree of reliability is required.
- Aids reflow when heating to remove components
- Apply to solder pads for placement of new components
- Use as an anti-tarnish, protective film on bare copper
- Provides excellent solderability for up to six months
- Zero halide content so no cleaning is required
- Passes copper plate and copper mirror corrosion tests
- Use with hot air, hot gas or conventional soldering
- Low non tacky/non corrosive residue
- Drying time 5 to 10 minutes at room temperature
- 12ml pen dispenser
- Electrolube type SMF12P
| Volume |
12ml |
| Flux Type |
Rosin |
| Dispensing Method |
Pen |