Xytronic IR-860 SMD/BGA Rework System

The IR860 rework system consists of a ceramic pre-heater, an infra-red solderlight and a controller. The solderlight is designed especially for SMD/BGA rework and is also very convenient for re-balling smaller BGA components. When used in conjunction with the pre-heater, the system will achieve remarkable improvements in quality and efficiency of SMD/BGA rework operations. In normal operation, the pre-heater supplies 75% of the heating from below with the remaining 25% from above via the solderlight. Heating from both sides reduces the risk of damage to components and the circuit board due to uneven expansion when only one side is heated.

• Quartz heater for fast heat-up time
• Adjustable PCB support frame
• Push-button control of temperature
• Independant control of solderlight and pre-heat temperatures
• Stand with built-in cooling fan for solderlight
• No need for endless types of hot-air nozzles for each device style
• Supplied complete with footswitch control for solderlight, 5 various style tweezers and vacuum pick-up tool
• Xytronic type IR860