Kerafol 1.00U110.ST.01000.W003387 pad silicone-free 1mm 100x100mm 2.0W/mK

Kerafol 1.00U110.ST.01000.W003387. The Kerafol 1.00U110.ST.01000.W003387 thermal pad is designed for effective thermal management applications. This silicone-free thermal interface material, measuring 100 x 100 mm with a thickness of 1 mm, offers high thermal conductivity of 2.0 W/mK, ensuring efficient heat transfer in electronic systems. Its composition is particularly suited for scenarios where silicone-based materials may be unsuitable or undesirable, such as in sensitive electronic components or devices. Typical applications include thermal management of CPUs, power modules, and LED assemblies, where reliable and consistent thermal performance is critical.

Type	Thermally conductive pad