TE Connectivity's 2-2013022-1 is a DIMM connector offering an unshrouded female interface.
It is designed for DDR3 with 204 positions, ensuring reliable data transfer.
The product is typically used in memory module applications for enhanced computer performance.
Its robust design supports secure connections in various electronic systems.
| Pitch |
0.6096mm |
| No. of Rows |
2 |
| No. of Ways |
204 |
| Circuit Application |
Power |
| Connector & Contact Terminates To |
Printed Circuit Board |
| Connector Mounting Type |
Board Mount |
| Connector Profile |
Standard |
| Connector System |
Cable-to-Board |
| Contact Base Material |
Copper Alloy |
| Contact Current Rating |
500mA |
| Contact Current Rating (Max) |
.5 |
| Contact Material |
Copper Alloy |
| Contact Mating Area Plating Material |
Gold Flash |
| Contact Plating |
Gold |
| Depth |
26mm |
| ELV |
Compliant |
| Flammability Rating |
UL94 V-0 |
| Height |
4mm |
| Housing Colour |
Black |
| Housing Material |
High Temperature Thermoplastic |
| Length |
71mm |
| Mating Alignment Type |
Standard Keying |
| Maximum Operating Temperature |
185°C |
| Memory Type |
SDRAM, DDR3 SDRAM, |
| Minimum Operating Temperature |
-67°C |
| Mount |
Surface Mount |
| Number of Contacts |
204 |
| Number of Positions |
204 |
| Number of Rows |
2 |
| Operating Temperature Range |
-67 – 185 |
| Orientation |
Right Angle |
| Package Quantity |
200 |
| Packaging |
Tape and Reel |
| Packaging Method |
Emboss on Reel |
| Packaging Quantity |
200 |
| PCB Contact Termination Area Plating Material |
Gold Flash |
| PCB Mount Retention |
With |
| PCB Mount Retention Type |
Solder Tail |
| Radiation Hardening |
No |
| RoHS Compliant |
Yes |
| Row Spacing |
0.322inch |
| Row-to-Row Spacing |
0.32200000000000001 |
| Sealable |
No (Without) |
| Stack Height |
0.157inch |
| Termination |
SMD/SMT |
| Termination Method to PCB |
Surface Mount |
| Type |
SO DIMM Sockets |
| UL Flammability Rating |
UL 94V-0 |
| Voltage Rating |
1.5v |
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