These thermal pads from Bergquist are designed to resist puncturing due to burrs or high pressures when mounting semiconductor devices to heatsinks. Constructed from Kapton and a thermally conductive elastomer coating loaded with aluminium oxide/boron nitride applied to both sides, K6 couples high dielectric strength with a no grease, no mess method of assembly.
- Blue green colour
- Size 19.05 x 12.7mm
- Thickness 0.006in
- 1.1W/m-K Thermal conductivity
- Suitable to fit TO-220
- Supplied in packs of 10
| Thermal Conductivity |
1.1W/m-K |
| Breakdown Voltage |
6000V |
| Material |
Silicone / Kapton |
| Package/Case |
TO-220 |
| Temperature Range |
-60 to +180°C |
| Thermal Resistance |
0.3°C/W |