Bergquist SPK6-0.006-00-54 Pk10 SIL-pad K6 Thermal Pads TO220

These thermal pads from Bergquist are designed to resist puncturing due to burrs or high pressures when mounting semiconductor devices to heatsinks. Constructed from Kapton and a thermally conductive elastomer coating loaded with aluminium oxide/boron nitride applied to both sides, K6 couples high dielectric strength with a no grease, no mess method of assembly.

• Blue green colour
• Size 19.05 x 12.7mm
• Thickness 0.006in
• 1.1W/m-K Thermal conductivity
• Suitable to fit TO-220
• Supplied in packs of 10