Flexible Hi-Flow is a phase-change material on an insulating substrate designed specifically to replace grease as a thermal interface. At +65°C Hi-Flow changes from a solid and flows (phase-change temperature) thereby assuring total wet-out of the interface. The thixotropic characteristics of the material prevent it from flowing out of the interface when mounted vertically. The result is a thermal interface without the mess and other problems associated with grease.
- 0.4W/m-K Thermal conductivity
- Supplied in packs of 10 pads to suit TO-3P devices
Breakdown Voltage |
4000V |
Material |
Phase change compound / PEN film |
Package/Case |
TO-3P |
Temperature Range |
-30 to +150°C |
Thermal Conductivity |
0.5W/m-K |
Thermal Resistance |
0.25°C/W |
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