Rapid Lead-Free Sn-Cu-Ag-Ni-Ge Solder 22SWG 0.7mm 0.5kg

Produced under license from Fuji, this lead-free 5-element solder contains tin (Sn), copper (Cu), silver (Ag), nickel (Ni) and germanium (Ge). The trace addition of nickel and germanium increases the fluidity of the solder and improves it's wettability by reducing oxidisation on the surface. It produces bright, smooth fillets without shrink cracks or hot tears.

• Trace addition of nickel produces less shorts and no shrinkage defects
• Nickel-stabilised intermetallic layer inhibits copper erosion
• Increased reliability in harsh environments
• High ductility ensures long service life of joints subjected to cyclic strain
• Produces minimal dross
• Minimal shorts and icicles
• Wets faster than silver-containing alternatives
• Produces bright, crack-free fillets
• Reduced copper erosion
• Superior performance in marine applications
• Excellent resistance to thermal fatigue
• Melting point 217 to 219°C
• Flux cored
• 22SWG (0.7mm) diameter
• Supplied on 500g reels