Gap Pad VO Soft is an electrically isolating, thermally conductive interface material that, due to its high conformability, is very efficient at filling-in air-gaps and voids between heat-generating components and heatsinks or chassis. The material is resistant to punctures, shearing and tearing, due to its carrier reinforcement, enabling better handling and, having inherent tackiness on one side, placement and conversion is made easier. The technical performance of this material make it ideally suited to applications where low application pressure is important, such as: computers and peripherals, telecommunications, power conversion.
- 0.8W/m-K Thermal conductivity
- Highly conformable for excellent gap-filling performance
- Rated to UL 94V-0
- Supplied in 100 x 100mm sheet form
| Thermal Conductivity |
0.8W/m-K |
| Breakdown Voltage |
6000V |
| Material |
Low modulus polymer / rubber coated fiberglass |
| Package/Case |
100 x 100 x 1.5mm |
| Temperature Range |
-60 to +200°C |