A general-purpose, black flame-retardant epoxy potting and encapsulating compound ideal for potting electrical and electronic components and assemblies.
The compound is supplied in a divided pack containing pre-measured amounts of resin and hardener. When the dividing clip is removed, the two parts can be mixed in the bag, preventing air entrapment and direct contact.
PCB potting and encapsulation
Capacitors
Transformers
Deep sea electronics
Approved to UL94 V-0 @ 3mm
High electrical insulating characteristics
Low shrinkage
Good thermal conductivity
High adhesion
Good chemical and water resistance
Low exothermic temperature rise protects components during cure
Compatible with most electronic components including polystyrene capacitors
Supplied in a 250g divided pack containing both resin and hardener
