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An epoxy resin with high thermal transfer and insulation characteristics. When mixed, the uncured liquid has very low viscosity ensuring good contact with the item being potted, ensuring that no air pockets or voids are produced. The resin will readily cure at room temperature or can be oven cured for speed. When set, the resin has a very low shrinkage and coefficient of thermal expansion.
Ideal for use with intricate electronic components which require heat transfer
Heat resistant up to 150°C
Supplied in a 250g separated twin pack of resin and hardener, which can be mixed before opening