The use of components for different soldering technologies (wave/reflow) often results in the PCB being assembled in stages. The concurrent use of SMD and THR PCB connection technology is aimed at reducing the number of production steps and manufacturing the module using just one soldering process. Adjustments to existing production equipment or to the process control system are to be avoided whenever possible.
Regardless of which assembly method is used – SMD or THR – the components must be developed for the individual process steps of SMT mounting and the respective requirements.
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