A 190 x 190 x 0.25mm thermal pad that has a design and construction that make it especially suitable for high-power applications. The 86-82 compound filler is reinforced with fibre glass and the pad has excellent thermal and electrical properties. Suitable for `high end` solutions, controlling boards, BGA applications, hard disc drives.
- Thermal conductivity 6.5W/mK
- Type 86/82
- Ideal for densely packed electronic applications
- Fibre glass reinforcement
- Flame class UL 94V-0
Breakdown Voltage |
1000V |
Material |
Silicone / fiberglass |
Package/Case |
190 x 190 x 0.25mm |
Temperature Range |
-40 to +200°C |
Thermal Conductivity |
6.5W/m-K |
Thermal Resistance |
0.09°C/W |
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