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You are in : Electronic Components > Semiconductor Hardware > Thermal Pads > UniPutty 1800 Thermal interface putty
UniPutty 1800 Thermal interface putty
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UniPutty 1800 is a soft gel designed to thermally connect heat generating electronic devices to cold walls, chassis or nearby metalwork. Manufactured using silicone and advanced thermal fillers, its thixotropic properties allow it to efficiently fill the air gap and provide a thermally conductive path between the hot device and the cold wall/chassis. Applications include cooling digital signal processors, power LEDs, wound components and DC-DC converters.

  • 1.8W/mK Thermal conductivity
  • Electrically isolating, thermally conductive
  • Excellent stability over a wide range of temperatures
  • Stays thixotropic for its lifetime
  • Syringe packaging for easy, accurate application
  • Cartridges for automated placement available on request
  • UL 94-V0 rated
  • Supplied in a 30cc syringe
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Unit of Sale 
Description Order Code 1+10+ Qty
UNIPUTTY 1800 30CC SYRINGE (RC)
  38-3074  RoHS  
 8.507.99 Alert
38-3074 Call 01206751166 for availability
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