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You are in : Electronic Components > Semiconductor Hardware > Thermal Pads > Sil-Pad 900S Thermally conductive high performance low-pressure insulating material
Sil-Pad 900S Thermally conductive high performance low-pressure insulating material
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A high performance thermally conductive material, with or without a thermally efficient adhesive, for applications requiring high thermal conductivity. The pads can be applied to either the heatsink or the device and are specifically designed for low mounting pressure applications.

  • 1.6W/m-K Thermal conductivity
  • Clip-mount pads have no fixing holes
  • Available to suit various semiconductor package profiles and in 4 x 4in sheet form
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Unit of Sale 
Description Order Code 1+10+50+100+ Qty
PK10 SIL-PAD 900-S TAC - T0220 (RC)
  38-1002  RoHS  
 1.401.301.201.10 Alert
38-1002 will be available in less than 1 month
PK10 SIL-PAD 900-S TO-220 (NO HOLES) RC
  38-1003  RoHS  
 1.401.301.201.10 Buy
PK10 SIL-PAD 900-SAC T03-P (RC)
  38-1006  RoHS  
 1.601.501.401.30 Buy
PK10 SIL-PAD 900S TO-220 DRY RC
  38-1074  RoHS  
 1.601.401.301.20 Buy
PK10 SIL-PAD 900S TO3P DRY RC
  38-1072  RoHS  
 1.851.601.501.40 Buy
 1+10+50+ 
SIL-PAD 900S 4" X 4" SHEET DRY RC
  38-1070  RoHS  
 4.253.653.05 Buy
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