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You are in : Electronic Components > Semiconductor Hardware > Thermal Pads > Hi-Flow 300P Thermally conductive phase-change interface material
Hi-Flow 300P Thermally conductive phase-change interface material
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Hi-Flow 300P consists of a high performance phase-change compound, coated on a thermally conductive and electrically isolating carrier, that is designed as a replacement for grease as a thermal interface. At a lower phase-change temperature of +55°C the material changes from a solid and flows, thereby assuring total wet-out of the interface. The thixotropic characteristics of the material prevent it from flowing out of the interface, giving a thermal performance comparable to grease but without the associated handling problems.

  • 1.6W/m-K Thermal conductivity
  • Phase-change temperature +55°C
  • Electrically isolating
  • Tack free
  • Scratch resistance at room temperature
  • Rated to UL 94V-0
  • Supplied in 4 x 4in sheet form in 0.015in thickness
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Unit of Sale 
Description Order Code 1+10+50+ Qty
HI-FLOW 300P 0.015" 4" X 4" SHEET RC
  38-1052  RoHS  
 5.655.103.95 Buy
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