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You are in : Electronic Components > Semiconductor Hardware > Thermal Pads > HP105 Phase change sheet
HP105 Phase change sheet
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This HP105 high performance phase change sheet has exceptionally low thermal resistance, and is designed for use with microprocessors, etc. The material is naturally tacky and requires no adhesive coating. It does not cure and can be easily removed without pulling out the processor etc. Due to its thixotropic properties this material makes an ideal replacement for grease for thermal management,

  • 0.73W/mK Thermal conductivity
  • Phase change softening range –50°C to +60°C
  • Does not cure - easy to remove
  • Dimensions: 75 x 75 x 0.125mm (3 x 3 x 0.005in)
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Unit of Sale 
Description Order Code 1+5+ Qty
HP105 PHASE CHANGE SHEET 3"X 3" (RC)
  38-3000  RoHS  
 4.904.20 Buy
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