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Gap Pad VO Ultra Soft is an electrically isolating, thermally conductive interface material that, because of its low hardness and low modulus design, has an ultra conformable performance that makes it ideal for applications where minimal pressure on components is required and where a very uneven interface gap exists, air-gaps and voids being filled-in, minimising interfacial resistance and maximising thermal transfer. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbency.
The materials carrier is reinforced, making handling easier and helping to protect against puncturing, tearing and shearing, and the material also has an inherent surface tack on one side which enables easier placement and conversion.
Suitable applications for this material include: bare-leaded components on PCBs, high voltage devices, automotive and handheld devices.
- 1.0W/m-K Thermal conductivity
- Ultra comformable for excellent gap-filling performance
- Low Youngs modulus
- Rated to UL 94V-0
- Available in 8 x 16in or 4 x 4in sheet form in various thicknesses (see price panel for details)
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| Thermal conductivity | 1.0W/m-K | | |
Heat capacity | 1.0J/g-K | | |
Breakdown voltage | >6000V AC | | |
Density | 1.6g/cc | | |
Hardness (Shore 00) | 5 | | |
Operating temperature | –60°C to +200°C | | |
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