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You are in : Electronic Components > Semiconductor Hardware > Thermal Pads > Gap Pad VO Thermally conductive conformable gap-filling material
Gap Pad VO Thermally conductive conformable gap-filling material
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Gap Pad VO is an electrically isolating, thermally conductive interface material that, due to its conformability, will fill-in air-gaps and voids between heat-generating components and heat sinks or chassis, reducing interfacial resistance and increasing thermal transfer. Having a reinforced carrier gives the material enhanced puncture, shear and tear resistance, whilst inherent tackiness on one side of the carrier makes handling easier. Suitable applications include: power conversion and telecommunications hardware.

  • 0.8W/m-K Thermal conductivity
  • Conformable for good gap-filling performance
  • Rated to UL 94V-0
  • Available in 4 x 4in sheet form in various thicknesses (see price panel for details)
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Unit of Sale 
Description Order Code 1+5+10+ Qty
GAP PAD VO 0.060" 4" X 4" SHEET RC
  38-1038  RoHS  
 5.505.004.75 Buy
GAP PAD VO 0.125" 4" X 4" SHEET RC
  38-1040  RoHS  
 11.0510.509.30 Buy
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