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Gap Pad 5000S35 is an electrically isolating, gap-filling material that features exceptionally high thermal performance at low mounting pressures, reinforced carrier for easy handling and converting, and high conformability to reduce interfacial resistance.
The material is inherently tacky on both sides and has very soft characteristics, whilst maintaining elasticity, that enables it to conform to demanding contours and maintain structural integrity with little or no stress applied to fragile components.
Typical applications include: memory packages/modules, voltage regulator modules, PC board to chassis, thermally enhanced BGAs, ASICs to DSPs.
- 5.0W/m-K Thermal conductivity
- Soft and highly conformable
- Fibreglass reinforced for puncture, shear and rear resistance
- Electrically isolating
- Rated to UL 94V-0
- Available in 8 x 16in sheet form in 1.52mm (0.06in) thickness
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| Thermal conductivity | 5.0W/m-K | | | Heat capacity | 1.0J/g-K | | | Breakdown voltage | >5000V AC | | | Density | 3.6g/cc | | | Hardness (Shore 00) | 35 | | | Operating temperature | –60°C to +200°C | | |
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