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Gap Pad 3000S30 features high thermal performance and electrical isolation at a low mounting pressure. Having inherent tackiness on both sides of the material, as well as fibreglass carrier reinforcement, enhances material handling, puncture, shear and tear resistance.
This material has been designed for high performance, low-stress applications as a replacement for standoff or clip-mounting thermal devices. Having a soft and conformable yet elastic nature ensures that, with its excellent wet-out and interfacing characteristics, an efficient thermal interface is achieved.
Suitable applications for this material include: processors, server S-RAMs, mass storage devices, BGA packages, notebook computers, power conversion, wireless communications hardware.
- 3.0W/m-K Thermal conductivity
- Low thermal resistance at low mounting pressure
- Electrically isolating
- High conformability
- Double-sided tackiness and carrier reinforcement ensure easy handling and assembly
- Rated to UL 94V-0
- Available in 4 x 4in sheet form in various thicknesses (see price panel for details)
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| Thermal conductivity | 3.0W/m-K | | |
Heat capacity | 1.0J/g-K | | |
Breakdown voltage | >3000V AC | | |
Density | 3.2g/cc | | |
Hardness (Shore 00) | 30 | | |
Operating temperature | –60°C to +200°C | | |
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