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Gap Pad 2500 is an electrically isolating gap-filling material that features medium compliancy and conformability, which is improved by the material being unreinforced. Good wet-out and interfacing characteristics to rough and uneven surfaces also ensure high thermal transfer.
The material is inherently tacky on both sides which allows for easy handling and assembly and, together with its excellent performance characteristics, make this material particularly suitable as a replacement for clip- and screw-mounted assemblies in such applications as: multiple heat generating components to a common heatsink, graphics/processor chips to heat sink interface, mass storage devices and wireless communications hardware.
- 2.7W/m-K Thermal conductivity
- High performance, cost effective solution
- Unreinforced construction for additional compliancy
- Protective liners on both sides of material
- Rated to UL 94V-0
- Available in 4 x 4in sheet form in various thicknesses (see price panel for details)
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| Thermal conductivity | 2.7W/m-K | | | Heat capacity | 1.0J/g-K | | | Breakdown voltage | >6000V AC | | | Density | 3.1g/cc | | | Hardness (Shore 00) | 80 | | | Operating temperature | –60°C to +200°C | | |
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