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You are in : Electronic Components > Semiconductor Hardware > Thermal Pads > Gap Pad 2000S40 Thermally conductive gap-filling material
Gap Pad 2000S40 Thermally conductive gap-filling material
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Gap Pad 2000S40 is a highly conformable, reinforced, gap-filling material that provides high thermal conductivity at very low mounting pressures. The material is electrically isolating and is suitable for isolation between heat sinks and bare-leaded, high voltage devices. Fibreglass reinforcement of the material enables easier handling and superior puncture, shear and tear resistance. High material conformability ensures that the material fills in air voids and gaps between heat sinks and devices.

  • 2.0W/m-K Thermal conductivity
  • Low thermal resistance at very low mounting pressures
  • Inherently tacky on both sides – aids in assembly
  • Low hardness with high conformability
  • Designed for low-stress applications
  • Rated to UL 94V-0
  • Available in 4 x 4in sheet form in various thicknesses (see price panel for details)
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Unit of Sale 
Description Order Code 1+5+10+ Qty
GAP PAD 2000S40 0.040" 4" X 4" SHEET RC
  38-1018  RoHS  
 10.959.959.00 Buy
GAP PAD 2000S40 0.080" 4" X 4" SHEET RC
  38-1020  RoHS  
 15.5014.5013.50 Buy
GAP PAD 2000S40 0.125" 4" X 4" SHEET RC
  38-1022  RoHS  
 19.5018.5017.50 Buy
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