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You are in : Electronic Components > Semiconductor Hardware > Thermal Pads > Bond-Ply 100 Thermally conductive adhesive material
Bond-Ply 100 Thermally conductive adhesive material
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Bond-Ply 100 is a thermally conductive and electrically isolating, pressure sensitive adhesive material that facilitates the decoupling of materials with mismatched thermal coefficients of expansion. The double-sided adhesive coating with its high bond strength that immediately bonds to the target surface, together with excellent wet-out and high thermal performance, make this material ideally suited to use as a replacement for heat-cure adhesive and screw- or clip-mounting solutions

  • 0.86W/m-K Thermal conductivity
  • Bond strength increases over time
  • Rated to UL 94V-0
  • Available in various sheet sizes (see price panel for details)
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Unit of Sale 
Description Order Code 1+10+25+ Qty
PK10 BOND-PLY 100 0.005" 1"X1" SHEET RC
  38-1010  RoHS  
 2.202.001.75 Buy
BOND-PLY 100 0.005" 12" X 12" SHEET RC
  38-1012  RoHS  
 20.0018.0015.00 Buy
BOND-PLY 100 0.005" 6" X 6" SHEET RC
  38-1014  RoHS  
 6.855.654.80 Buy
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