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| 16th October 2008
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Electronic Components
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Semiconductor Hardware
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Thermal Pads
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Bond-Ply 100 Thermally conductive adhesive material
Bergquist
Gap Pad 2000S40 Thermally conductive gap-filling material
Bergquist
Gap Pad 2500 Thermally conductive unreinforced gap-filling material
Bergquist
Gap Pad 3000S30 Thermally conductive soft gap-filling material
Bergquist
Gap Pad 5000S35 Thermally conductive high performance gap-filling material
Bergquist
Gap Pad VO Soft Thermally conductive highly conformable gap-filling material
Bergquist
Gap Pad VO Thermally conductive conformable gap-filling material
Bergquist
Gap Pad VO Ultra Soft Thermally conductive ultra conformable gap-filling material
Bergquist
Hi-Flow 105 Thermally conductive coated aluminium phase-change interface material
Bergquist
Hi-Flow 300P Thermally conductive phase-change interface material
Bergquist
Hi-Flow 625 Thermally conductive phase-change interface material
Bergquist
HP105 Phase change sheet
Universal Science
Q-Pad 3 Thermally conductive non-insulating grease replacement material
Bergquist
Sil-Pad 1200 Thermally conductive exceptional performance insulator material
Bergquist
Sil-Pad 2000 Thermally conductive high performance insulating material
Bergquist
Sil-Pad 400 Thermally conductive insulating material
Bergquist
Sil-Pad 900S Thermally conductive high performance low-pressure insulating material
Bergquist
Sil-Pad A1500 Thermally conductive insulator material
Bergquist
Sil-Pad K-10 Thermally conductive high performance puncture resistant insulating material
Bergquist
Sil-Pad K6 Thermally conductive puncture resistant insulating material
Bergquist
T-FLEX 200 gap filler
Universal Science
T-Pad 1500
Universal Science
T-Pad 6000 Ultra thermally conductive pad
Universal Science
UniGrease 3800 High performance thermal grease
Universal Science
UniPutty 1800 Thermal interface putty
Universal Science
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